Items

• AF TTK 003 PLM Data interpretation
  Micromorphology of thin section from AF TTK 003.
• AF TTK 003 PLM processing and modeling
  Petrographic examination.
• AF TTK 003 PLM acquisition
  Photomicrographs acquired at different magnifications
• AF TTK 002 PLM Data interpretation
  Micromorphology of thin section from AF TTK 002.
• AF TTK 002 PLM processing and modeling
  Petrographic examination.
• AF TTK 002 PLM acquisition
  Photomicrographs acquired at different magnifications.
• AF TTK 010 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF TTK 010 OM acquisition
  Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 010
• AF TTK 009 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF TTK 009 OM acquisition
  Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 009.
• AF TTK 008 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF TTK 008 OM acquisition
  Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic samples AF TTK 008
• AF TTK 007 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF TTK 007 OM acquisition
  Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 007.
• AF TTK 006 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF TTK 006 OM acquisition
  Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic shard.
• AF TTK 005 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF TTK 005 OM acquisition
  Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 005.
• AF TTK 004 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF TTK 004 OM acquisition
  Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 004.
• AF TTK 003 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF TTK 003 OM acquisition
  Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 003.
• AF TTK 002 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF TTK 002 OM acquisition
  Optical microscopy (stereomicroscopy) on surface and reflected light microscopy on polished cross sections of ceramic samples AF TTK 002.
• AF TTK 001 PLM Data interpretation
  Micromorphology of thin section from AF TTK 001.
• AF TTK 001 PLM processing and modeling
  Petrographic examination.
• AF TTK 001 PLM acquisition
  Photomicrographs acquired at different magnifications.
• AF TTK 001 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF TTK 001 OM acquisition
  Optical microscopy (stereomicroscopy) on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 001
• AF ISH 007 PLM Data interpretation
  Micromorphology of thin section from AF ISH 007.
• AF ISH 007 PLM processing and modelling
  Petrographic examination.
• AF ISH 007 PLM acquisition
  Photomicrographs acquired at different magnifications.
• AF ISH 007 OM processing and modelling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF ISH 007 OM acquisition
  Optical microscopy (stereomicroscopy) on surface and reflected light microscopy on polished cross sections of ceramic samples AF ISH 007.
• AF ZMT 006 PLM Data interpretation
  Micromorphology of thin section from AF ZMT 006
• AF ZMT 006 PLM processing and modelling
  Petrographic examination.
• AF ZMT 006 PLM acquisition
  Photomicrographs acquired at different magnifications.
• AF ZMT 006 OM processing and modelling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF ZMT 005 PLM Data interpretation
  Micromorphology of thin section from AF ZMT 005.
• AF ZMT 005 PLM processing and modelling
  Petrographic examination.
• AF ZMT 005 PLM acquisition
  Photomicrographs acquired at different magnifications.
• AF ZMT 005 OM processing and modelling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF ZMT 005 OM acquisition
  Optical microscopy (stereomicroscopy) on surface and reflected light microscopy on polished cross sections of ceramic sample AF ZMT 005.
• AF ZMT 004 PLM Data interpretation
  Micromorphology of thin section from AF ZMT 004.
• AF ZMT 004 PLM processing and modeling
  Petrographic examination
• AF ZMT 004 PLM acquisition
  Photomicrographs acquired at different magnifications
• AF ZMT 004 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF ZMT 003 PLM Data interpretation
  Micromorphology of thin section from AF ZMT 003.
• AF ZMT 003 PLM processing and modeling
  Petrographic examination.
• AF ZMT 003 PLM acquisition
  Photomicrographs acquired at different magnifications
• AF UEN 002 PLM Data interpretation
  Micromorphology of thin section from AF UEN 002
• AF UEN 002 PLM processing and modeling
  Petrographic examination.
• AF UEN 002 PLM acquisition
  Photomicrographs acquired at different magnifications
• AF ZMT 003 OM process and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF UEN 002 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF UEN 001 PLM Data interpretation
  Micromorphology of thin section from AF UEN 001.
• PRELIMINARY INDICATIONS - THIN SECTION ANALYSIS
  Preliminary indications on ceramic thin section petrographic analysis.
• Guidelines for Petrographic examination in thin section
  Guidelines for Ceramic Petrographic examination in thin section
• AFC TBO STC 1057
  Sueki pottery fragment of bottom with quartz inclusions and polished in the external surface. P56, P55, P34, P73, P45, P36, P79, P75 in Oka.
• AF TBO STC 057 ＊
  Sueki pottery fragment of bottom with quartz inclusions and polished in the external surface. P73 in Oka.
• AF TBO STC 1028＊
  古墳時代(TK217型式)の須恵器杯蓋片。 岡山大学遺物番号P28。 AF TBO STC 012と接合。
• AF TBO STC 1082
  Sue ware fragment of pottery wall (kame) displaying marks deriving from paddle and anvil manufacturing technique. P81 in Oka. Combines with AF TBO STC 1081 to form AFC TBO STC 066. 古墳時代の須恵器片。 岡山大学遺物番号P81。 AF TBO STC 1081と接合（AFC TBO STC 066）。
• AF TBO STC 1081
  Sue ware fragment of pottery wall (kame) displaying marks deriving from paddle and anvil manufacturing technique. P81 in Oka. Combines with AF TBO STC 1082 to form AFC TBO STC 066. 古墳時代の須恵器片。 岡山大学遺物番号P81。 AF TBO STC 1082と接合。（AFC TBO STC 066）
• AF TBO STC 1069 ＊
  Fragment of pottery wall, maybe Sueki, with quartz inclusions. Maybe a jar. P69 in Oka.
• AF UEN 001 OM processing and modeling
  Incisions description (parallel, curved and even impressions). Inclusions characterization (color, shape and size). Cross section characterization (in case of visible layers).
• AF ZMT 006 OM acquisition
  Optical microscopy (stereomicroscopy) on surface and reflected light microscopy on polished cross sections of ceramic sample AF ZMT 006.
• AF ZMT 004 OM acquisition
  Optical microscopy (stereomicroscopy) on surface and reflected light microscopy on polished cross sections of ceramic sample AF ZMT 004.
• AF ZMT 003 OM acquisition
  Optical microscopy (stereomicroscopy) on surface and reflected light microscopy on polished cross sections of ceramic sample AF ZMT 003.
• AF UEN 002 OM acquisition
  Optical microscopy (stereomicroscopy) on surface and reflected light microscopy on polished cross sections of ceramic sample AF UEN 002.
• AF TBO STC 1078＊
  古墳時代須恵器口縁部片。 岡山大学遺物番号P78
• AF TBO STC 1077＊
  古墳時代須恵器口縁部片。 岡山大学遺物番号P77
• AF TBO STC 1102＊
  古墳時代須恵器片。 岡山大学遺物番号P102。
• AF TBO STC 1100＊
  古墳時代須恵器片。 岡山大学遺物番号P100。
• AFC TBO STC 1013＊
  古墳時代土師器口縁部・底部片。 岡山大学遺物番号P13
• AFC TBO STC 1105 ＊
  Haji pottery fragment of Wall, small inckusions of quartz P105＆P115 in Oka
• AF ZMT 006 XRPD processing and modelling
  Mineralogical analysis
• AF ZMT 006 XRPD acquisition
  X-ray Powder Diffraction analysis on sample AF ZMT 006.
• AF ZMT 005 XRPD processing and modelling
  Mineralogical analysis.
• AF ZMT 005 XRPD acquisition
  X-ray Powder Diffraction analysis on sample AF ZMT 005.
• AF ZMT 004 XRPD processing and modeling
  Mineralogical analysis
• AF ZMT 004 XRPD acquisition
  X-ray Powder Diffraction analysis on sample AF ZMT 004.
• AF ZMT 003 XRPD processing and modeling
  Mineralogical analysis.
• AF ZMT 003 XRPD acquisition
  X-ray Powder Diffraction analysis on sample AF ZMT 003.
• AF UEN 002 XRPD acquisition
  X-ray Powder Diffraction analysis on sample AF UEN 002.
• AF UEN 001 XRPD processing and modeling
  Mineralogical analysis.
• AF UEN 001 XRPD acquisition
  X-ray Powder Diffraction analysis on sample AF UEN 001.
• AF ISH 007 XRPD processing and modeling
  Mineralogical analysis.
• AF ISH 007 XRPD acquisition
• Shimane and Tatetsuki ICP-OES Data plots
  Chemical composition analysis - Inductively Coupled Plasma Optical Emission Spectrometry (ICP-OES). SH1 and SH2 = AF UEN 001 and AF UEN 002 SH3 to SH6 = AF ZMT 003 to AD ZMT 006 SH7 = AF ISH 007
• Ishidai
  Ishidai archaeological site, prefecture of Shimane. 石台遺跡, 島根県.
• AF TTK 008 XRPD processing and modeling
  Mineralogical analysis
• AF TTK 008 XRPD acquisition
  X-ray Powder Diffraction from shard AF TTK 008.
• AF TTK 009 XRPD processing and modeling
  Mineralogical analysis
• AF TTK 009 XRPD acquisition
  X-ray Powder Diffraction from sample AF TTK 009.
• AF TTK 007 XRPD processing and modeling
  Mineralogical analysis
• AF TTK 007 XRPD acquisition
  X-ray Powder Diffraction from shard AF TTK 007.
• AF TTK 006 XRPD processing and modeling
  Mineralogical analysis
• AF TTK 006 XRPD acquisition
• AF TTK 005 XRPD processing and modeling
  Mineralogical analysis.
• AF TTK 005 XRPD acquisition