-
AF TTK 003 PLM Data interpretation
Micromorphology of thin section from AF TTK 003.
-
AF TTK 003 PLM processing and modeling Petrographic examination.
-
AF TTK 003 PLM acquisition Photomicrographs acquired at different magnifications
-
AF TTK 002 PLM Data interpretation Micromorphology of thin section from AF TTK 002.
-
AF TTK 002 PLM processing and modeling
Petrographic examination.
-
AF TTK 002 PLM acquisition Photomicrographs acquired at different magnifications.
-
AF TTK 010 OM processing and modeling
Incisions description (parallel, curved and even impressions).
Inclusions characterization (color, shape and size).
Cross section characterization (in case of visible layers).
-
AF TTK 010 OM acquisition Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 010
-
AF TTK 009 OM processing and modeling
Incisions description (parallel, curved and even impressions).
Inclusions characterization (color, shape and size).
Cross section characterization (in case of visible layers).
-
AF TTK 009 OM acquisition Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 009.
-
AF TTK 008 OM processing and modeling
Incisions description (parallel, curved and even impressions).
Inclusions characterization (color, shape and size).
Cross section characterization (in case of visible layers).
-
AF TTK 008 OM acquisition Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic samples AF TTK 008
-
AF TTK 007 OM processing and modeling
Incisions description (parallel, curved and even impressions).
Inclusions characterization (color, shape and size).
Cross section characterization (in case of visible layers).
-
AF TTK 007 OM acquisition Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 007.
-
AF TTK 006 OM processing and modeling
Incisions description (parallel, curved and even impressions).
Inclusions characterization (color, shape and size).
Cross section characterization (in case of visible layers).
-
AF TTK 006 OM acquisition Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic shard.
-
AF TTK 005 OM processing and modeling
Incisions description (parallel, curved and even impressions).
Inclusions characterization (color, shape and size).
Cross section characterization (in case of visible layers).
-
AF TTK 005 OM acquisition Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 005.
-
AF TTK 004 OM processing and modeling
Incisions description (parallel, curved and even impressions).
Inclusions characterization (color, shape and size).
Cross section characterization (in case of visible layers).
-
AF TTK 004 OM acquisition Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 004.
-
AF TTK 003 OM processing and modeling
Incisions description (parallel, curved and even impressions).
Inclusions characterization (color, shape and size).
Cross section characterization (in case of visible layers).
-
AF TTK 003 OM acquisition Optical microscopy (stereomicroscopy= on surface and reflected light microscopy on polished cross sections of ceramic sample AF TTK 003.
-
AF TTK 002 OM processing and modeling
Incisions description (parallel, curved and even impressions).
Inclusions characterization (color, shape and size).
Cross section characterization (in case of visible layers).
-
AF TTK 002 OM acquisition Optical microscopy (stereomicroscopy) on surface and reflected light microscopy on polished cross sections of ceramic samples AF TTK 002.
-
AF TTK 001 PLM Data interpretation
Micromorphology of thin section from AF TTK 001.
